Research output per year
Research output per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Education/Academic qualification
Bachelor of Engineering in Electronic and Communication Engineering, City University of Hong Kong
Bachelor of Business Administration in Marketing, The Hong Kong Polytechnic University
Bachelor of Engineering in Industrial and System Engineering, The Hong Kong Polytechnic University
Doctor of Philosophy, The Hong Kong Polytechnic University
Fingerprint
Dive into the research topics where Wai Sze Yip is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Research output
-
A review: Insight into smart and sustainable ultra-precision machining augmented by intelligent IoT
Xu, Z., Zhu, T., Luo, F. L., Zhang, B., Poon, H., Yip, W. S. (Corresponding Author) & To, S. (Corresponding Author), Jun 2024, In: Journal of Manufacturing Systems. 74, p. 233-251 19 p.Research output: Journal article publication › Review article › Academic research › peer-review
5 Citations (Scopus) -
Designing ultrathin and long ferromagnetic nanowires array for Tunable-Range Majorana zero mode studies
Li, K. C., Lam, L. Y. F., Hu, X., Lam, K. C., To, S., Yip, W. S. (Corresponding Author) & Wong, C. H. (Corresponding Author), Jan 2024, In: Results in Physics. 56, 5 p., 107322.Research output: Journal article publication › Journal article › Academic research › peer-review
Open Access1 Citation (Scopus) -
Development of optimal monitoring strategies for smart ultra-precision machining using social network analysis
Xu, Z., Guo, F., Zhang, B., Yip, W. S. (Corresponding Author) & To, S. (Corresponding Author), Aug 2024, In: Journal of Manufacturing Systems. 75, p. 24-41 18 p.Research output: Journal article publication › Journal article › Academic research › peer-review
1 Citation (Scopus) -
Digital-twin-driven intelligent tracking error compensation of ultra-precision machining
Xu, Z., Zhang, B., Li, D., Sze Yip, W. (Corresponding Author) & To, S. (Corresponding Author), 1 Oct 2024, In: Mechanical Systems and Signal Processing. 219, 23 p., 111630.Research output: Journal article publication › Journal article › Academic research › peer-review
-
Effect of grain orientation angles and compressive parameters on the deformation characteristics and corrosion property of 6061 Al alloy
Ma, H., Tang, J., Geng, P. (Corresponding Author), Bandaru, A. K. (Corresponding Author), Qin, G., Luo, R., Ma, N., Yip, W. S. (Corresponding Author) & To, S. (Corresponding Author), Jul 2024, In: Materials Characterization. 213, 16 p., 114006.Research output: Journal article publication › Journal article › Academic research › peer-review
2 Citations (Scopus)
Prizes
-
49th International Exhibition of Inventions Geneva - Silver medal
To, S. (Recipient), Sun, Z. (Recipient), Yip, W. S. (Recipient), Du, X. (Recipient), Wang, S. (Recipient) & Xu, S. (Recipient), 19 Apr 2024
Prize: Prize (research)
File -
First Prize, Province final game
Yan, H. (Recipient), Tan, W. (Recipient) & Yip, W. S. (Supervisor), May 2024
Prize: Prize (research)
File -
Special award prize, National final game
Yan, H. (Recipient), Tam, W. K. (Recipient) & Yip, W. S. (Supervisor), May 2024
Prize: Prize (research)
File -
The 17th China-Japan International Conference on Ultra-Precision Machining Process (CJUMP) 2023 - Best Paper Award
To, S. (Recipient), Yan, H. (Recipient), Tang, J. (Recipient), He, T. (Recipient), Wang, W. W. (Recipient), Guo, F. (Recipient) & Yip, W. S. (Recipient), 23 Oct 2023
Prize: Prize (research)
File -
The 17th China-Japan International Conference on Ultra-Precision Machining Process (CJUMP) 2023 - Best Presentation Award
To, S. (Recipient), Zhu, T. (Recipient), Yip, W. S. (Recipient) & Lee, K. M. (Recipient), 23 Oct 2023
Prize: Prize (research)
File