Calculated based on number of publications stored in Pure and citations from Scopus
20032024

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  • 2024

    AI-based Failure mechanism prediction system and method for PCB solder joints

    Lam, K. M. (Inventor), FUNG, Ka Chun (Inventor), Lai, Cheung Ming (Inventor), LIN, Kwan Ho (Inventor), Loo, K. H. (Inventor), Yung, K. C. (Inventor), Choy, H. S. (Inventor), XUE, Kaiwen (Inventor), Aziz, S. (Inventor) & NG Vincent To Yee (Inventor), 19 Jan 2024, Patent No. HK30094933, 8 Nov 2023

    Research output: Patents, agreements, assignments and companiesPatents granted

  • A System and Method of Power MOSFET Diagnostic and Lifetime Estimation Using AI Algorithm

    Loo, K. H. (Inventor), Lee, H. H. (Inventor) & Lu, C. (Inventor), 12 Jan 2024, Patent No. HK30094384, 1 Nov 2023

    Research output: Patents, agreements, assignments and companiesPatents granted

  • 2023

    Bidirectional Spectral-Based Transformer for Remaining Useful Life Prediction

    Lam, K. M. (Inventor), Fung, K. C. (Inventor), Lai, C. M. (Inventor), Lin, K. H. (Inventor), Loo, K. H. (Inventor) & Yung, K. C. (Inventor), 6 Apr 2023, Patent No. HK30079023, 30 Dec 2022

    Research output: Patents, agreements, assignments and companiesPatents granted