ACM International Conference on Tangible, Embedded, and Embodied Interaction (TEI '22)

Wei, H. (Technical Co-chair)
Valentina Nisi (Technical Co-chair)

School of Design

Activity: Participating in or organising an event › Organizer / committee member

Description

Served as a Pictorial Chair for TEI 2022.

Period	May 2021 → Feb 2022
Event type	Conference
Degree of Recognition	International

Documents & Links

https://tei.acm.org/2022/participate/pictorials/